10U configuration
GPU OAM Cooling / AI Server Cooling Solution
MLHP loop heat pipe cooling technology engineered for high power GPU cooling and AI server thermal management, supporting ultra-high heat flux cooling requirements up to 450 W/cm2.
10U configuration
Ultra-high heat flux cooling
AI server modules
Two-phase loop heat pipe
Key Capability Indicators
A practical MLHP loop heat pipe cooling path for high-power GPU OAM modules, AI server thermal management and next-generation high heat flux cooling projects.
One key advantage: deployment can remain as straightforward as existing 3DVC solutions.
Installation, validation and operation processes remain familiar, allowing system designers to adopt advanced MLHP cooling without changing established workflows. This keeps the page focused on 3DVC-compatible deployment while still matching GPU OAM cooling, AI server cooling solution and high-power chip cooling search intent.
Thermal Architecture Comparison
For teams comparing loop heat pipe vs vapor chamber architectures, evaluating a 3D vapor chamber or searching for a 3DVC alternative, MLHP provides an architecture designed for higher thermal demand and high-power GPU OAM development.
One-way loop circulation with liquid returning directly toward the die.
Designed for AI server and high heat flux GPU module applications.
Custom configuration support for form factor and thermal requirements.
Application Scenarios
MLHP cooling is positioned for high-power GPU OAM, AI server and custom electronics cooling projects.
High-power GPU cooling for compact accelerator platforms.
A cooling solution for AI servers with next-generation GPU compute loads.
High heat flux cooling for performance-intensive computing hardware.
High power electronics cooling design for server and chip developers.
Custom Thermal Engineering
Shengrongyuan supports engineering teams developing high-power GPU cooling and AI server thermal management solutions with customized MLHP designs.
Chip power, heat flux, envelope and airflow conditions.
MLHP architecture adapted for the target platform.
Engineering samples prepared for evaluation and optimization.
Manufacturing support for validated thermal solutions.
Technical Questions
MLHP is Shengrongyuan's loop heat pipe based two-phase thermal solution for high-power chip cooling, including GPU OAM and AI server applications.
The illustrated MLHP configurations support up to 2400W for 8U, 1700W for 6U and 1200W for 4U applications, with heat flux density up to 450 W/cm2.
MLHP uses a loop heat pipe structure with directional fluid circulation and direct-to-die liquid return, positioned for next-generation high-power GPU thermal requirements.
Yes. Engineering review can consider power, heat flux, mechanical envelope and platform integration requirements before prototype evaluation for an AI server platform.